Thin-film-deposition equipment

ABSTRACT

The present disclosure provides a thin-film-deposition equipment, which includes a main body, a carrier and a shielding device, wherein a portion of the shielding device and the carrier are disposed within the main body. The main body includes a reaction chamber, and two sensor areas connected to the reaction chamber, wherein the sensor areas are smaller than the reaction chamber. The shielding device includes a first-shield member, a second-shield member and a driver. The driver interconnects the first-shield member and the second-shield member, for driving the first-shield member and the second-shield member to move in opposite directions. During a deposition process, the two shield members are separate from each other into an open state, and respectively enter the two sensor areas. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier.

TECHNICAL FIELD

The present disclosure relates to a thin-film-deposition equipment,which mainly employs a shielding device to cover a substrate carrier, inorder to prevent polluting the carrier during a process of cleaning thereaction chamber.

BACKGROUND

Thin-film-deposition equipments, such as chemical-vapor deposition(CVD), physical-vapor deposition (PVD) and the atomic-layer deposition(ALD) equipments, those are commonly employed in manufacturing processof semiconductors, light-emitting diodes and displays, etc.

A thin-film-deposition equipment mainly includes a chamber and asubstrate carrier, wherein the substrate carrier is within the chamberfor carrying at least one substrate. To exemplify by PVD, a targetmaterial is required to dispose within the chamber, wherein the targetmaterial faces the substrate on the substrate carrier. When performingPVD, noble gas or reactive gas is transferred into the chamber, thenbias electricity is applied on the target material and the substratecarrier respectively, also the substrate carried on by the substratecarrier is heated up.

The noble gas or reactive gas within the chamber transforms into ionizedgas in effect of a high-voltage electric field, then the ionized gas isattracted by the bias electricity to bombard the target material.Thereby, atoms or molecules splashed from the target material areattracted by the bias electricity on the substrate carrier, then bedeposited on surface of the substrate and forms a thin film on thesurface of the substrate.

After some time of usage, an inner surface of the chamber may also beformed with thin film, then a periodic cleaning is required to performto the chamber, in order to prevent the waste thin film from droppingonto the substrate and causing pollution during the process of thin-filmdeposition. Moreover, surface of the target material may be formed withoxide or other pollutant, therefore requires a periodic cleaning aswell. Generally, a burn-in process is applied to bombard the targetmaterial within the chamber by plasma ions, then to remove the oxides orpollutants on the surface of target material.

To perform the abovementioned cleaning process, the substrate carrierand the substrate must be extracted or kept out, to prevent the removedpollutant from turning to pollute the substrate carrier and thesubstrate, during the cleaning process.

SUMMARY

Generally, after some time of usage, the thin-film-deposition equipmentis required for cleaning, in order to remove the waste thin film withinthe chamber and the oxide or nitride on the target material. During thecleaning process, some removed pollutant particles may turn to pollutethe substrate carrier, thus there is a need to keep out the substratecarrier from the removed pollutant. The present disclosure provides athin-film-deposition equipment, which mainly employs a driver to rotateand swing two shield members in opposite angular directions to approachor leave each other, such that to operate between a shielding state andan open state. Thereby, the shield members in shielding state can coverand shield the substrate carrier, to prevent the removed pollutantparticles from turning to pollute the substrate carrier during theprocess of cleaning the chamber or the target material.

An object of the present disclosure is to provide a thin-film-depositionequipment with shielding device, which includes a main body, a carrierand a shielding device, wherein the carrier and a part of the shieldingdevice are disposed within the main body. The main body includes areaction chamber having a containing space therein, and two sensor areasconnected to the reaction chamber, wherein each of the sensor areas hasa sensing space fluidly connected to the containing space.

During a process of cleaning the reaction chamber, the driver swings thetwo shield members to approach each other into the shielding state, suchthat the two shield members come together to cover the substrate carrierwithin a containing space, in order to prevent a plasma employed toproceed the cleaning or some removed waste pollutant from turning topollute the substrate carrier and/or the substrate thereon.Alternatively, during a process of performing the deposition, the driverswings the two shielding members to leave each other, such that topermit the process to proceed on the substrate within the reactionchamber.

In the open state, the two shield members are separate from each other,wherein the two shield members partially enter the two sensor areas ofthe main body, respectively. Moreover, each of the two sensor areas isdisposed with at least one position sensor, for detecting and confirmingthat the shield members have entered the sensor areas and been in theopen state.

An object of the present disclosure is to provide a thin-film-depositionequipment with shielding device, which employs two shield members thatcan combine to form a whole shield, thereby to improve space efficiency.In one embodiment, the two shield members sway in opposite angulardirections within the containing space of the main body, wherein themain body includes a reaction chamber and two sensor areas. The twoshield members are operable between an open state and a shielding statewithin the containing space of the reaction chamber. In the shieldingstate, the two shield members come together and cover the carrier withinthe containing space of the reaction chamber. In the open state, the twoshield members respectively and partially enters the two sensor areas,wherein the position sensors in the sensor areas detect and confirm thatthe shield members have entered the sensor areas and been in the openstate.

When it is confirmed by the sensor areas that the shield members are inthe open state, the carrier is permitted to move toward the targetmaterial, for performing a thin-film deposition to the substrate on thecarrier. Such that to prevent the shield members from interfering themovement of the carrier and causing collision therebetween, thenresulting in damage to the shield members or the carrier.

An object of the present disclosure is to provide a thin-film-depositionequipment, wherein the driver interconnects the two shield members viatwo connecting arms, each of the connecting arms sustains a behalf ofthe shield member. Moreover, the two connecting arms may be configuredto sustain thicker shield members, which are durable against deformationcaused by high temperature, for better performance of the shieldmembers.

To achieve the abovementioned object, the present disclosure provides athin-film-deposition equipment, which includes: a main body that has areaction chamber formed with a containing space therein, and two sensorareas fluidly connected to the containing space, wherein each of thesensor areas has a height shorter than that of the reaction chamber; acarrier disposed within the containing space for carrying at least onesubstrate; and a shielding device includes a first-shield member and asecond-shield member, a driver interconnecting the first-shield memberand the second-shield member for respectively swinging the first-shieldmember and the second-shield member in opposite directions, such thatthe first-shield member and the second-shield member are switchablebetween an open state and a shielding state, wherein in the open state,the first-shield member and the second-shield member are partiallywithin sensing space of the sensor areas, and wherein in the shieldingstate, the first-shield member and the second-shield member are withinthe containing space for covering the carrier.

Another object of the present disclosure is to provide theabovementioned thin-film-deposition equipment, wherein each of the twoshield members has a surface facing each other and respectively disposedwith a cavity and a protrusion. The driver drives and swings the twoshield members to approach each other, wherein the protrusion on one ofthe shield member is inserted into the cavity on another one of theshield member, such that the two shield members form a whole shield.

To achieve the abovementioned object, the present disclosure providesthe aforementioned thin-film-deposition equipment, wherein: thefirst-shield member includes a first-inner-edge surface formed with atleast one protrusion; the second-shield member includes asecond-inner-edge surface formed with at least one cavity correspondingto the protrusion of the first-inner-edge surface.

Another object of the present disclosure is to provide theabovementioned thin-film-deposition equipment, wherein the shieldingdevice further includes two guard plates, for guarding the shieldmembers from damage caused by high-temperature matters or the heatitself.

To achieve the abovementioned object, the present disclosure providesthe aforementioned thin-film-deposition equipment, which includes afirst-guard plate disposed on a surface of the first-shield member; anda second-guard plate disposed a surface of the second-shield member,wherein the first-guard plate and the second-guard plate also canapproach each other to cover the first-shield member and thesecond-shield member together.

Another object of the present disclosure is to provide theabovementioned thin-film-deposition equipment, wherein the shieldingdevice includes two drivers respectively connected to the two shieldmembers.

To achieve the abovementioned object, the present disclosure providesthe aforementioned shielding device, wherein the driver includes: afirst driver connected to the first-shield member; and a second driverconnected to the second-shield member, wherein the first driver and thesecond driver respectively drive and swing the first-shield member andthe second-shield member in the opposite directions, thereby thefirst-shield member and the second-shield member are switchable betweenthe open state and the open state.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure as well as preferred modes of use, further objects, andadvantages of this present disclosure will be best understood byreferring to the following detailed description of some illustrativeembodiments in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic sectional view illustrating a shielding device ofa thin-film-deposition equipment which is operated in a shielding state,according to one embodiment of the present disclosure.

FIG. 2 is a schematic perspective view illustrating the shielding deviceof the thin-film-deposition equipment which is operated in an openstate, according to one embodiment of the present disclosure.

FIG. 3 is a schematic perspective view illustrating the shielding deviceof the thin-film-deposition equipment which is in the shielding state,according to one embodiment of the present disclosure.

FIG. 4 is a schematic perspective sectional view illustrating a driverof the shielding device, according to one embodiment of the presentdisclosure.

FIG. 5 is a schematic top view illustrating the shielding device of thethin-film-deposition equipment which in the open state, according to oneembodiment of the present disclosure.

FIG. 6 is a schematic top view illustrating the shielding device of thethin-film-deposition equipment which in the shielding state, accordingto one embodiment of the present disclosure.

FIG. 7 is a schematic fragmentary sectional view illustrating theshielding device of the thin-film-deposition equipment which is in theopen state, according to one embodiment of the present disclosure.

FIG. 8 is a schematic fragmentary sectional view illustrating theshielding device of the thin-film-deposition equipment which leaves asensor area, according to one embodiment of the present disclosure.

FIG. 9 is a schematic top view illustrating the shielding device of thethin-film-deposition equipment which in is the open state, according toa different embodiment of the present disclosure.

FIG. 10 is a schematic perspective view illustrating the shieldingdevice of the thin-film-deposition equipment which is in the open state,according to another embodiment of the present disclosure.

FIG. 11 is a schematic fragmentary sectional view illustrating afirst-shield member and a second-shield member of the shielding devicewhich are separate from each other, according to another embodiment ofthe present disclosure.

FIG. 12 is a schematic fragmentary sectional view illustrating thefirst-shield member and the second-shield member of the shielding devicewhich are in the shielding state, according to another embodiment of thepresent disclosure.

FIG. 13 is a schematic fragmentary sectional view illustrating thefirst-shield member and the second-shield member which are separate fromeach other, according to another different embodiment of the presentdisclosure.

FIG. 14 is a schematic perspective view illustrating the shieldingdevice of the thin-film-deposition equipment which is in the open state,according to yet another embodiment of the present disclosure.

FIG. 15 is a schematic fragmentary sectional view illustrating thefirst-shield member and the second-shield member of the shielding devicewhich are in the shielding state, according to yet another embodiment ofthe present disclosure.

FIG. 16 is a schematic fragmentary sectional view illustrating thefirst-shield member and the second-shield member of the shielding devicewhich are in the shielding state, according to another differentembodiment of the present disclosure.

FIG. 17 is a schematic fragmentary sectional view illustrating thefirst-shield member and the second-shield member of the shielding devicewhich are in the shielding state, according to yet another differentembodiment of the present disclosure.

FIG. 18 is a schematic perspective view illustrating the shieldingdevice of the thin-film-deposition equipment which is in the open state,according to yet another different embodiment of the present disclosure.

FIG. 19 is a schematic perspective view illustrating the shieldingdevice of the thin-film-deposition equipment which is in the open state,according to one more embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1 , which is a schematic sectional view illustrating ashielding device 100 of a thin-film-deposition equipment 10 which isoperated in a shielding state, according to one embodiment of thepresent disclosure. As shown in the FIG, the thin-film-depositionequipment 10 main includes a main body 11, a carrier 13 and a shieldingdevice 100. The main body 11 includes a reaction chamber 110, and twosensor areas 113 connected to the reaction chamber 110.

The reaction chamber includes a containing space 12, for containing thecarrier 13 and a part of the shielding device 100. Each of the sensorareas 113 includes a sensing space 120, wherein each of the sensingspaces 120 is fluidly connected to containing space 12 of the reactionchamber 110.

The carrier 13 is positioned within the containing space 12 of thereaction chamber 11, for carrying at least one substrate 163. In thisembodiment, the thin-film-deposition equipment 10 is exemplified as aphysical-vapor deposition chamber. The reaction chamber 110 is disposedwithin a target material 161 and has the target material 161 facing thesubstrate 163 and the carrier 13. The target material 161 may bedisposed on a ceiling surface of the reaction chamber 110 to face thecarrier 13 and/or the substrate 163 within the containing space 12, forexample.

Referring to FIG. 2 and FIG. 3 , the shielding device 100 includes afirst-shield member 151 and a second-shield member 153 and a driver 17,wherein the first-shield member 151 and the second-shield member 153 arepositioned the containing space 12. The driver 17 interconnects thefirst-shield member 151 and the second-shield member 153, and drives,swings the first-shield member 151 and the second-shield member 153 inopposite angular directions, such as to have the first-shield member 151and the second-shield member 153 swaying toward or away from each othersynchronously, about an axle of the driver 17.

In one embodiment of the present disclosure, the driver 17 interconnectsthe first-shield member 151 and the second-shield member 153, via afirst-connecting arm 141 and a second-connecting arm 143 respectively.Such that, the driver 17 swings the first-connecting arm 141 and thesecond-connecting arm 143, to further respectively move the first-shieldmember 151 and the second-shield member 153, in the opposite directions.

The first-shield member 151 and the second-shield member 153 may beformed as plates with similar shapes, such as respectively formed as onehalf and another half of a round plate. Such that, as the driver 17swings the first-shield member 151 and the second-shield member 153toward each other, the two members 151, 153 come together and form awhole round shield 15, for covering and shielding the carrier 13 and/orthe substrate 163.

In this embodiment, the first-shield member 151 and the second-shieldmember 153 can be operated to move into a shielding state, which isdefined as the first-shield member 151 and the second-shield member 153continue to approach each other, until a distance between the twomembers 151, 153 is less than a threshold value, such as 1 millimeter(mm). To be specific, the first-shield member 151 and the second-shieldmember 153 do not actually contact each other but keep a gap spacetherebetween, such that to avoid a collision or friction therebetween,which may create some wear-off particles therefrom to pollute thecontaining space 12 of the reaction chamber 110 and/or the carrier 13therein.

However, with the abovementioned structure, a gap space 254 (FIG. 11 )remains between the first-shield member 151 and the second-shield member153, which may still allow a plasma or pollutants created during acleaning process to pass and then to pollute the carrier 13 and/or thesubstrate 163 thereon, during the cleaning process. Therefore, in oneembodiment of the present disclosure, the first-shield member 151 andthe second-shield member 153 may be disposed in different heights, suchas to have the first-shield member 151 positioned higher than thesecond-shield member 153. With such configuration, when the first-shieldmember 151 and the second-shield member 153 are operated to move intothe shielding state, the two shield members 151, 153 can partiallyoverlap for a full coverage.

The first-shield member 151 and the second-shield member 153 formed withsimilar, half-round shapes and area sizes, which is merely oneembodiment of the present disclosure, therefore claim scope of thepresent disclosure is not limited thereto. In practical use, thefirst-shield member 151 and the second-shield member 153 may be formedwith different area sizes and shapes, such rectangular plates, ellipseplates or plates in any other geometric shape, moreover, thefirst-shield member 151 may have an area size larger than that of thesecond-shield member 153. What is essential for the claim scope of thepresent disclosure is that, two shield members which can approach eachother to form a whole shield for covering the carrier and/or substratethereon.

For this embodiment, the first-shield member 151 and the second-shieldmember 153 are both formed as half-round plates, each of the shieldmember 151, 153 is formed with a straight, flat inner-edge surface(similar to a first-inner-edge surface 2511 and a second-inner-edgesurface 2531 in an embodiment of FIG. 10 ), and also formed with acurved outer-edge surface (similar to a first-outer-edge surface 2531and a second-outer-edge surface 2533 in the embodiment of FIG. 10 ).Moreover, the inner-edge surface of the first-shield member 151 and theinner-edge surface of the second-shield member 153 correspond to eachother. When the driver 17 drives and swings the first-shield member 151and the second-shield member 153 to approach each other, the two shieldmembers 151, 153 come together and form the whole round shield 15, alsoto have the two inner-edge surfaces thereof facing each other. However,the claim scope of the present disclosure is not limited to suchstraight and flat inner-edge surfaces of the shield members 151, 253, inpractical use, the inner-edge surfaces may be formed in concave andconvex shapes or zig-zag shapes corresponding to each other, it is onlysufficient to have the inner-edge surfaces of the two shield members toapproach and be adjacent to each other, for effectively cover thecarrier 13.

Moreover, in a different embodiment of the present disclosure, theinner-edge surface of the first-shield member 151 may be configured toincline related to a top surface (upside of FIG. 2 ) or a bottom surface(downside of FIG. 2 ) of the first-shield member 151. In the other hand,the inner-edge surface of the second-shield member 153 may also beconfigured to incline related to a top surface (upside of FIG. 2 ) or abottom surface (downside of FIG. 2 ) of the second-shield member 153.Also, the inner-edge surface of the first-shield member 151 and theinner-edge surface of the first-shield member 151 are formedsubstantially parallel and corresponding to each other, such that whenthe two shield members 151, 153 are in the shielding state, the gapspace is formed in an inclined manner, which can be effective forblocking the pollutants falling vertically downward.

In one embodiment of the present disclosure as shown in FIG. 4 , thedriver 17 includes at least one motor 171 and a shaft seal 173, whereinthe motor 171 is connected to the first-shield member 151 and thesecond-shield member 153 via the shaft seal 173. The motor 171 ispositioned outside of the containing space 12 within the reactionchamber 110. The shaft seal 173 extends from the motor 171 and into thereaction chamber 110, and hence partially disposed within the containingspace 12.

Specifically, the shaft seal 173 includes an outer tube 1731 and aninner shaft 1733. The outer tube 1731 has an inner space 1732 forcontaining the inner shaft 1733, wherein the outer tube 1731 and theinner shaft 1733 are disposed concentrically. Moreover, the outer tube1731 and the inner shaft 1733 can be driven by the motor 171 to rotaterelative to each other. The outer tube 1731 is connected to thefirst-connecting arm 141, and such that able to swing the first-shieldmember 151 to hence move the first-connecting arm 141. The inner shaft1733 is connected to the second-connecting arm 143, and such that ableto swing the second-shield member 153 to hence move thesecond-connecting arm 143.

The shaft seal 173 may be a common shaft seal component, which is mainlyfor isolating the containing space 12 of the reaction chamber 110 froman outside thereof and maintaining a vacuum condition within thecontaining space 12. In a different embodiment of the presentdisclosure, the shaft seal 173 may be a magnetic liquid rotary sealing,which includes a plurality of bearings, at least one permanent magnet,at least one pole piece and at least one ferrofluid. For example, thebearings may be disposed within the outer tube 1731 and surround anouter surface the inner shaft 1733, such that to facilitate the relativerotation of the inner shaft 1733 and the outer tube 1731. The permanentmagnet is disposed on an inner surface of the outer tube 1731 andbetween two bearings. Moreover, two annular pole pieces are alsodisposed on the inner surface of the outer tube 1731, and each of thepole pieces is positioned between the permanent magnet and one of thebearings respectively. Furthermore, the inner shaft 1733 may be formedwith two groove portions, the pole pieces are disposed to respectivelysurround groove portions of the inner shaft 1733, also with theferrofluid disposed between the groove portions and the pole pieces. Itshould be noted that the shaft seal 173 as a magnetic liquid rotarysealing, which is merely one embodiment of the present disclosure,therefore which does not limit the claim scope of the presentdisclosure.

In one embodiment of the present disclosure as shown in FIG. 4 , themotor 171 may be two respectively connected to the outer tube 1731 andthe inner shaft 1733 of the shaft seal 173, to drive the outer tube 1731and the inner shaft 1733 to rotate in opposite directions, such that toswing the first-shield member 151 and the second-shield member 153 inthe opposite directions via the outer tube 1731 and the inner shaft1733.

In a different embodiment of the present disclosure, the motor 171 maybe just one with a drive mechanism (e.g. gear system or linkage system,etc.), such that to drive, swing the first-connecting arm 141 and thesecond-connecting arm 143 and to further move the first-shield member151 and the second-shield member 153 in the opposite directions.

In more detail, Thin-film-deposition equipment 10 and/or the shieldingdevice 100 according to the present disclosure, which can be operated toswitch between two states as an open state and a shielding state. Asshown in FIG. 2 and FIG. 6 , the driver 17 can drive, swing thefirst-shield member 151 and the second-shield member 153 to move in theopposite directions, such that the first-shield member 151 and thesecond-shield member 153 leave each other and move into the open state.In the open state, the first-shield member 151 and the second-shieldmember 153 have an open space 152 therebetween, such that thefirst-shield member 151 and the second-shield member 153 do not getbetween the target material 161 and the carrier 13 with the substrate163 thereon.

Moreover, when the two shield members 151, 153 are operated into theopen state, a small portion of the first-shield member 151 and a smallportion of the second-shield member 153 respectively enter the sensingspaces 120 of the two sensor areas 113, which are fluidly and spatiallyconnected to the containing space 120. Also to mention that, in the openstate, a relatively large portion of the first-shield member 151 and arelatively large portion of the second-shield member 153 still remainwithin the containing 12.

In a different embodiment of the present disclosure as shown in FIG. 1 ,the containing space 12 of the reaction chamber 110 may be disposed witha tubular blocking member 111, which has one end connected to theceiling surface of the reaction chamber 110, and another end formed withan opening 112. Such that, when the carrier 13 approaches the targetmaterial 161, the carrier 13 also enters the opening 112 or contacts theblocking 111. The reaction chamber 110, the carrier 13 and the blockingmember 111 together define a reactive space within the containing space12, for forming the thin film on the substrate 163 within the reactivespace, such that to prevent the blew-off particles of the targetmaterial 161 from spreading out of the reactive space and formingundesired thin film outside.

In the opposite manner, as shown in FIG. 3 and FIG. 6 , the driver 17can drive, swing the first-shield member 151 and the second-shieldmember 153 to approach each other and move into the shielding state. Inthe shielding state, the first-shield member 151 and the second-shieldmember 153 come together and form the whole shield 15 between the targetmaterial 161 and the carrier 13, such that to cover and shield thecarrier 13 from the target material 161.

As shown in FIG. 1 , the shield 15 and the blocking member 111 togethercan define a cleaning space 121 within the containing space 12, whereinthe cleaning space 121 and the aforementioned reactive space havepartially or completely spatial overlap. A burn-in process may beperformed within the cleaning space 121, to clean the target material161, the ceiling surface of the reaction chamber 110 and/or an inside ofthe blocking member 111, and to remove oxides, nitrides or otherpollutants on the target material 161, also to remove undesired, wastethin film within the reaction chamber 110 and/or the blocking member111.

Furthermore, during the process of cleaning the thin-film-depositionequipment 10, the carrier 13 and/or the substrate 163 are covered,protected by the shield 15, thereby to prevent the pollutants createdduring the cleaning process from turning to deposit and pollute surfaceof the carrier 13 and/or the substrate 163.

In further detail, the present disclosure separates the shield 15 intothe two shield members 151, 153, and carries the first-shield member 151and the second-shield member 153 respectively via the first-connectingarm 141 and the second-connecting arm 143, such that to each of theconnecting arms 141, 143 only needs to bear half weight of the shield15.

The two connecting arms 141, 143 may be configured to carry thicker andheavier shield members 151, 153, which are durable against thermaldeformation caused by high temperature, and which can hence preventplasma or pollutant created during the cleaning process from sneakingthrough and contacting the carrier 13 or the substrate 163 below, with ahigher reliability.

Also, as the shield 15 split into two shield members 151, 153, this canhelp to reduce, minimize spaces for storing the two shield members 151,153 in the open state, such that to improve a space efficiency of thereaction chamber 110.

In on embodiment of the present disclosure, as shown in FIG. 5 and FIG.6 , the reaction chamber 110 may be formed with a cubic appearance and arectangular cross-section, and the two sensor areas 113 are respectivelymounted on two opposite sides of the reaction chamber 110. As shown inFIG. 5 and FIG. 7 , when the shield members 151, 153 are operated intothe open state, the first-shield member 151 and the second-shield member153 are partially and respectively positioned within the sensing spaces120 of the two sensor areas 113.

In on embodiment of the present disclosure, each of the two sensor areas113 is disposed with the least one position sensor 19, for respectivelydetecting the first-shield member 151 and the second-shield member 153entering the sensing spaces 120. The position sensors 19 are configuredto confirm that the first-shield member 151 and the second-shield member153 are in the open state, when the position sensors 19 detected thatthe two shield members 151, 153 within the sensing spaces 120. As theposition sensors 19 confirmed the open state the shield members 151,153, the carrier 13 with the substrate 163 thereon is driven by anelevating unit (not shown), to approach the target material 161.Thereafter, a process gas (e.g. noble gas) is energized to bombard thetarget material 161, such that some blew-off particles of the targetmaterial 161 fall and be deposited on the substrate 163 to form a thinfilm thereon.

If the carrier 13 moves to approach the target material 161 when thefirst-shield member 151 and the second-shield member 153 have not yetmove into the open state, a collision may occur between the carrier 13and the first-shield member 151 and the second-shield member 153, andthereby to cause damage to the carrier 13, the first-shield member 151or the second-shield member 153.

In practical use, the sensor areas 113 may be formed as extensionchambers of the reaction chamber 110, wherein the each of sensor areas113 has a height shorter than that of the reaction chamber 110. Suchthat, the sensor areas 113 are relatively thinner than the reactionchamber 110 in an up-down direction as shown in FIG. 1 , the sensingspaces 120 thereof are also formed relative narrow. In more detail, eachof the sensor areas 113 has two opposite surfaces, such as an uppersurface (upside of FIG. 1 ) and a lower surface (downside of FIG. 1 ).Each of the position sensors 19 may include an emitter 191 and areceiver 193 respectively disposed on the opposite surfaces of each ofthe sensor areas 113, to have the receiver 193 able to receive a signalemitted from the emitter 191. Also, the position sensors 19 may beoptical sensors. Also to mention that, by virtue of such relative shortand thin sensor areas 113, the emitter 191 and the receiver 193 of theposition sensors 19 can be relatively easy to mount into the sensorareas 113 from outside.

As shown in FIG. 7 , when the two shield members 151, 153 are operatedinto the open state and respectively enter the sensing spaces 120 of thetwo sensor areas 113, each of the shield members 151, 153 respectivelyblocks the signal from the emitter 191 and cause the receiver 193 unableto receive the signal, in such manner to confirm that the shield members151, 153 are in the open state.

In an opposite manner as shown in FIG. 6 and FIG. 8 , when the twoshield members 151, 153 are operated into the shielding state, each ofwhich 151, 153 all leaves the sensing spaces 120, such that, thereceiver 193 is able to receive the signal of the emitter 191 and henceto confirm the two shield members 151, 153 are not in the open state. Atthis moment, the carrier is not permitted to move toward the targetmaterial 161, thereby to prevent the collision between the carrier 13and the shield members 151, 153, or even the damage thereof.

In practical use, according to how the other components, mechanisms andmovements thereof in the thin-film-deposition equipment 10 are arranged,the shielding device 100 may be disposed at different locations withinthe reaction chamber 110. For example, as shown in FIG. 9 , the driver17 of the shielding device 100 of the thin-film-deposition equipment 20may be disposed on or near by a corner of the reaction chamber 210/orthe containing space 12, also, the two sensor areas 213 are disposed,mounted on two adjacent edge sides of the cubic reaction chamber 210,such that the reaction chamber 110 can be further disposed with passagesor gas-extraction pipelines at edge sides thereof.

Referring to FIG. 10 ˜FIG. 12 , wherein FIG. 10 is a schematicperspective view illustrating the shielding device 200 of thethin-film-deposition equipment which is in the open state, FIG. 11 is aschematic fragmentary sectional view illustrating the first-shieldmember 251 and the second-shield member 253 of the shielding device 200which are separate from each other, and FIG. 12 is a schematicfragmentary sectional view illustrating the first-shield member 251 andthe second-shield member 253 of the shielding device 200 which are inthe shielding state, according to another embodiment of the presentdisclosure. The shielding device 200 in this embodiment is similar tothat in aforementioned embodiments, but different in structures of thefirst-shield member 251 and the second-shield member 253. Thefirst-shield member 251 has at least one protrusion 2515 formed on thefirst-inner-edge surface 2511, in the other hand, the second-shieldmember 253 has at least one cavity 2535 formed on the second-inner-edgesurface 2531. Furthermore, the protrusion 2515 on the first-inner-edgesurface 2511 corresponds to the cavity 2535 on the second-inner-edgesurface 2531, and the protrusion 2515 is formed slightly smaller thanthe cavity 2535.

As shown in FIG. 11 and FIG. 12 , the protrusion 2515 is positioned atmiddle of the first-inner-edge surface 2511 on the first-shield member251, the cavity 2535 is also positioned at middle of thesecond-inner-edge surface 2531 on the second-shield member 253. However,in another different embodiment as shown in FIG. 13 , the protrusion2515 a may be positioned at an upper portion of the first-inner-edgesurface 2511 a of the first-shield member 251 a, and the cavity 2535 amay also be positioned at a upper portion of the second-inner-edgesurface 2531 a.

As shown in FIG. 12 , in this embodiment, when the first-shield member251 and the second-shield member 253 are operated in the shieldingstate, between the first-shield member 251 and the second-shield member253, the first-inner-edge surface 2511 and the second-inner-edge surface2531 are adjacent to each other and maintain the gap space 254,furthermore, the protrusion 2515 on the first-inner-edge surface 2511enters the cavity 2535 on the second-inner-edge surface 2531 but stillmaintain the gap space 254 therebetween.

Similar to the aforementioned embodiment, the gap space 254 between thefirst-inner-edge surface 2511 and the second-inner-edge surface 2531 isconfigured less than the aforementioned threshold value, such as 1 mm.Thereby, the first-shield member 251 and the second-shield member 253 donot contact each other, nor the protrusion 2515 and the cavity 2535thereon, in order prevent the collision or friction therebetween.

Also, similar to the aforementioned embodiment, the first-shield member251 and the second-shield member 253 are formed as half-round plates,with straight and flat inner-edge surfaces 2511, 2531. However, thepresent disclosure is mot limited thereto, in other embodiment, theinner-edge surfaces may be formed in concave and convex shapes orzig-zag shapes, or even inclined planes but still corresponding to eachother,

Referring to FIG. 14 and FIG. 15 , wherein FIG. 14 is a schematicperspective view illustrating the shielding device of thethin-film-deposition equipment which is in the open state, and FIG. 15is a schematic fragmentary sectional view illustrating the first-shieldmember and the second-shield member of the shielding device which are inthe shielding state, according to yet another embodiment of the presentdisclosure. In comparison with the aforementioned embodiments, theshielding device 300 in this embodiment, which includes a first-guardplate 381 and a second-guard plate 383 respectively disposed on thefirst-shield member 351 and the second-shield member 353. With suchstructure, as the driver 17 drives, swings the connecting arms 341, 343to move second-shield members 351, 353 toward each other into theshielding state, the first-guard plate 381 and the second-guard plate383 also come together to get between the shield members 351, 353 andthe target material 161, to provide further coverage and protection forthe shield members 351, 353.

The guard plates 381, 383 mainly serve to block the high-temperaturematters or the heat created during the process of cleaning the reactionchamber 110 and the target material 161, from directly contacting theshield members 351, 353, such that to prevent thermal deformation andmalicious effect occurring thereto.

Also to mention that, when the shield members 351, 353 are in theshielding state, the guard plates 381, 383 do not contact each otherneither, in order to avoid a collision or friction therebetween fromcreating wear-off particles and hence to pollute the containing space 12and/or the carrier 13 within the reaction chamber 110. Such that, asshown in FIG. 15 , when the shield members 351, 353 are in the shieldingstate, the shield members 351, 353 maintain a first gap space 354therebetween, the guard plates 381, 383 also maintain a second gap space384 therebetween, wherein first gap space 354 and second the gap space384 have some spatial overlap, in this embodiment. Moreover, thefirst-shield member 351 and the first-guard plate 381 both may be formedwith similar half-round shapes and area sizes, and so do thesecond-shield member 353 and the second-guard plate 383.

In one embodiment of the present disclosure, the guard plates 381, 383are connected to the shield members 351, 353 via a plurality of supportunits 385, and thereby a gap 382 is respectively formed between thefirst-guard plate 381 and the first-shield member 351, and between thesecond-guard plate 383 and the second-shield member 353. The gaps 382can serve prevent the high temperature generated during the cleaningprocess from directly transferring from the guard plates 381, 383 intothe shield members 351, 353, such that to further prevent the thermaldeformation of the shield members 351, 353.

In yet another embodiment of the present disclosure, as shown in FIG. 16, the guard plates 381 a, 383 a and the shield members 351, 353 may beconfigured to have the first gap space 354 a and the second gap space384 a not spatially overlap each other. In this embodiment, the twoshield members 351, 353 have substantially identical area sizes, whereasthe two guard plates 381 a, 383 a have different area sizes, such as thefirst-guard plate 381 a may be formed larger than the second-guard plate383 a. However surely, in practical use, it may also be configured intoan opposite manner, such as the two shield members 351, 353 havedifferent area sizes, whereas the two guard plates 381 a, 383 a havesubstantially identical area sizes, which makes no spatial overlapbetween the first gap space 354 a and the second gap space 384 a aswell.

When the first gap space 354 has no spatial overlap with the second gapspace 384, the high-temperature matters and the heat of the cleaningprocess is prevented from directly passing through the second gap space384 then the first gap space 354, and then to reach the carrier 13,thereby to improve the coverage for the carrier 13 and/or the substrate163.

As shown in FIG. 17 and FIG. 18 , in another different embodiment of thepresent disclosure, similar to the two shield members 351, 353, the twoguard plates 381 b, 383 b respectively have inner-edge surfaces facingand corresponding each other, wherein the inner-edge surfaces of the twoguard plates 381 b, 383 b may be formed in an inclined manner andsubstantially parallel to each other. Such that, when in the shieldingstate, the second gap space 384 b formed between the two guard plates381 b, 383 b, which inclines related to the first gap space 354 betweenthe two shield members 351, 353, such that to tilt away from the secondgap space 384 b for preventing the pollutant from passing through andentering the first gap space 354, in a more effective manner. Surely, inother different embodiment, the two shield members 351, 353 may also beconfigured to have the inner surfaces thereof formed in the inclined,substantially parallel manner, such that to tilt, orient both the firstgap space and the second gap space, for a further effective performanceagainst the falling pollutants.

In one embodiment of the present disclosure similar to theaforementioned one, along with the first-shield member 351 and thesecond-shield member 353 that are positioned in different heights, thefirst-guard plate 181 and the second-guard plate 183 can also bedisposed in different heights, such as to have the first-shield member351 positioned higher than the second-shield member 353, with thefirst-guard plate 381 also positioned higher than the second-guard plate383. Such that, when in the shielding state, the first-shield member 351partially covers top of the second-shield member 353 and hence overlapstherewith, the first-guard plate 381 also partially covers a top of thesecond-guard plate 183 and overlaps therewith, thereby to improve thecoverage for the carrier 13 and/or the substrate 163.

Surely, along with the shield members 351, 353 that may be formed indifferent shapes, the guard plates 381, 383 may also be formed in anygeometric shapes.

Referring to FIG. 19 , which is a schematic perspective viewillustrating the shielding device 400 of the thin-film-depositionequipment which is in the open state, according to one more embodimentof the present disclosure. In comparison with the aforementionedembodiment, the driver 47 in this embodiment is configured as a firstdriver 471 and a second driver 473. The first driver 471 and the seconddriver 473 are respectively connected power-transmittably to thefirst-shield member 151 and the second-shield member 153, such that todrive and swing the first-shield member 151 and the second-shield member153 to move in the opposite directions. For example, the first-shieldmember 151 and the second-shield member 153 may synchronously sway inthe opposite directions, respectively about an axle of the first driver471 and an axle of the second driver 473.

To be specific, the first driver 471 and the second driver 473 canrespectively drive, swing the first-shield member 151 and thesecond-shield member 153 to move away from each other into the openstate, or to move toward each other into the shielding state.

In one embodiment of the present disclosure, the first driver 471 andthe second driver 473 respectively include motors 4711, 4731 and shaftseals 4713, 4733, which are structures similar to the aforementionedmotor 171 and shaft seal 173.

Also similar to the aforementioned embodiments, in practical use, thefirst driver 471 and the second driver 473 may be connected to thefirst-shield member 151 and the second-shield member 153, respectivelyvia the first-connecting arm 141 and the second-connecting arm 143.

Surely, the first driver 471 and the second driver 473 may be configuredto respectively connect to and drive the aforementioned first-shieldmember 251, 251 a and the second-shield member 252, 252 a, or even thefirst-shield member 351 and the second-shield member 352 with thefirst-guard plate 381 and the second-guard plate 383 thereon, to switchbetween the open state and the shielding state as well.

Moreover, in other embodiment, the two drivers 471, 473 may be disposedat or near by a corner of the containing space 12 or the reactionchamber 110, such that to allow the passage for the substrate 163 or thegas-extraction pipeline disposed at the edge side of the containingspace 12 or the reaction chamber 110.

In addition, for the shielding devices 200, 300, 400 in aforementionedembodiments, the thin-film-deposition device 10 may also be furtherdisposed with the position sensors 19, in order to detect and confirm ifthe shield members 251, 251 a, 351, 252, 252 a, 352, and/or the guardplate 381, 381 a, 383, 381 a are in the open state.

The above disclosure is only the preferred embodiment of the presentdisclosure, and not used for limiting the scope of the presentdisclosure. All equivalent variations and modifications on the basis ofshapes, structures, features and spirits described in claims of thepresent disclosure should be included in the claims of the presentdisclosure.

We claim:
 1. A thin-film-deposition equipment, comprising: a main body comprising: a reaction chamber that has a containing space; and two sensor areas that are connected to the reaction chamber, wherein each of the sensor areas has a sensing space fluidly connected to the containing space, and each of the sensor areas has a height shorter than the reaction chamber; a carrier disposed within the containing space for carrying at least one substrate; and a shielding device comprising: a first-shield member; a second-shield member; and a driver that interconnects the first-shield member and the second-shield member for respectively driving and swinging the first-shield member and the second-shield member to move in opposite directions and between an open state and a shielding state, wherein in the open state, the first-shield member and the second-shield member are partially and respectively positioned within the sensing spaces of the sensor areas, and in the shielding state, the first-shield member and the second-shield member approach each other and be adjacent to each other for covering the carrier within the containing space.
 2. The thin-film-deposition equipment according to claim 1, wherein the driver comprises a shaft seal and at least one motor; and the at least one motor is connected to the first-shield member and the second-shield member via the shaft seal.
 3. The thin-film-deposition equipment according to claim 2, wherein the shaft seal comprises an outer tube and an inner shaft; the outer tube comprises an inner space for containing the inner shaft; the at least one motor is connected to the first-shield member via the outer tube, and is connected to the second-shield member via the inner shaft, such that to synchronously drive and swing the inner shaft and the outer tube to move in the opposite directions.
 4. The thin-film-deposition equipment according to claim 1, wherein the first-shield member of the shielding device comprises a top surface, a bottom surface, and a first-inner-edge surface formed in an inclined manner relative to the top surface or the bottom surface; and wherein the second-shield member of the shielding device comprises a top surface, a bottom surface, a second-inner-edge surface relative to the top surface or the bottom surface.
 5. The thin-film-deposition equipment according to claim 1, further comprising two position sensors that are respectively disposed within the sensor areas, for respectively detecting the first-shield member and the second-shield member which enter the sensing spaces.
 6. The thin-film-deposition equipment according to claim 5, wherein each of the position sensors comprises an emitter and a receiver; and each of the sensor areas has two opposite surfaces respectively disposed with the emitter and the receiver.
 7. The thin-film-deposition equipment according to claim 1, wherein in open state, each of the first-shield member and the second-shield member has a smaller portion within the sensing space of a corresponding one of the sensor areas, and a larger portion within the containing space.
 8. The thin-film-deposition equipment according to claim 1, wherein in the shielding state, the first-shield member and the second-shield member partially overlap.
 9. The thin-film-deposition equipment according to claim 1, further comprising a target material that is disposed within the containing space and that faces the carrier, wherein in the shielding state, the first-shield member and the second-shield member are positioned between the target material and the carrier.
 10. The thin-film-deposition equipment according to claim 1, wherein the driver of the shielding device is disposed at a corner of the containing space of the reaction chamber.
 11. The thin-film-deposition equipment according to claim 1, wherein the first-shield member of the shielding device comprises a first-inner-edge surface formed with at least one protrusion; the second-shield member of the shielding device comprises a second-inner-edge surface formed with at least one cavity; the at least one protrusion on the first-inner-edge surface corresponds to the at least one cavity on the second-inner-edge surface; and in the shielding state, the first-inner-edge surface of the first-shield member and the second-inner-edge surface of the second-shield member are adjacent to each other, the at least one protrusion on the first-inner-edge surface enters the at least one cavity on the second-inner-edge surface, the first-shield member and the second-shield member come together and cover the carrier.
 12. The thin-film-deposition equipment according to claim 11, wherein when the first-shield member and the second-shield member are in the shielding state, the first-shield member and the second-shield member have a gap space therebetween.
 13. The thin-film-deposition equipment according to claim 1, wherein the shielding device further comprises a first-guard plate disposed on the first-shield member; and a second-guard plate disposed on the second-shield member; and the first-guard plate and the second-guard plate respectively move along with the first-shield member and the second-shield member, for guarding the first-shield member and the second-shield member.
 14. The thin-film-deposition equipment according to claim 13, wherein in the shielding state, the first-shield member and the second-shield member have a first gap space therebetween; the first-guard plate and the second-guard plate have a second gap space therebetween; and the first gap space and the second gap space do not spatially overlap.
 15. The thin-film-deposition equipment according to claim 14, wherein each of the first-guard plate and the second-guard plate has an inner-edge surface; and the inner-edge surface of the first-guard plate and the inner-edge surface of the second-guard plate are formed inclined and corresponding to each other, such that in the shielding state, the inner-edge surface of the first-guard plate and the inner-edge surface of the second-guard plate face each other to form the second gap space in an inclined manner relative to the first gap space.
 16. The thin-film-deposition equipment according to claim 14, wherein the shielding device has the first-guard plate formed with an area size larger than that of the second-guard plate, or has the first-shield member formed with an area size larger than that of the second-shield member.
 17. The thin-film-deposition equipment according to claim 13, wherein the first-shield member of the shielding device comprises a first-inner-edge surface formed with at least one protrusion; the second-shield member of the shielding device comprises a second-inner-edge surface formed with at least one cavity; the at least one protrusion on the first-inner-edge surface corresponds to the at least one cavity on the second-inner-edge surface; and in the shielding state, the first-inner-edge surface of the first-shield member and the second-inner-edge surface of the second-shield member are adjacent to each other, the at least one protrusion on the first-inner-edge surface enters the at least one cavity on the second-inner-edge surface, the first-shield member and the second-shield member come together and cover the carrier.
 18. The thin-film-deposition equipment according to claim 1, wherein the driver comprises a first driver connected to the first-shield member, and a second driver connected to the second-shield member; and the first driver and the second driver respectively drive and swing the first-shield member and the second-shield member to move in the opposite directions between the open state and the shielding state.
 19. The thin-film-deposition equipment according to claim 18, wherein each of the first driver and the second driver respectively comprises a shaft seal and at least one motor; and the at least one motor of the first driver is connected to the first-shield member via the shaft seal, the at least one motor of the second driver is connected to the second-shield member via the shaft seal.
 20. The thin-film-deposition equipment according to claim 18, wherein the first-shield member of the shielding device comprises a first-inner-edge surface formed with at least one protrusion; the second-shield member of the shielding device comprises a second-inner-edge surface formed with at least one cavity; the at least one protrusion on the first-inner-edge surface corresponds to the at least one cavity on the second-inner-edge surface; and in the shielding state, the first-inner-edge surface of the first-shield member and the second-inner-edge surface of the second-shield member are adjacent to each other, the at least one protrusion on the first-inner-edge surface enters the at least one cavity on the second-inner-edge surface, the first-shield member and the second-shield member come together and cover the carrier. 